VIA ELECTRONIC has developed a strong manufacturing know-how in low-temperature co-fired ceramics for highly integrated electronic devices. Its high permeability and permittivity and the good dielectric characteristics of ceramic, make this know-how suitable for controller electronics, RF designs, microsystems and sensors.


Technology assets

  • ability to embed passive elements, such as resistors, capacitors and inductors into the ceramic package, minimising the size of the module;
  • possibility to achieve a single multilayer laminated package with a high integration and interconnection level;
  • scientific or industrial applications in harsh environments, low or high temperature, vacuum or magnetic sensors for medical, defense, aerospace, telecommunications or automotive.

Interested in this technology?

Contact

Nicolas LOUEE

Technology Broker